| PART |
Description |
Maker |
| 160MT100KB 160MT120K 160MT120KB 160MT160KB 130MT80 |
THREE PHASE BRIDGE 三相桥式
800V 3 Phase Bridge in a INT-A-Pak package
1400V 3 Phase Bridge in a INT-A-Pak package
1000V 3 Phase Bridge in a INT-A-Pak package
1200V 3 Phase Bridge in a INT-A-Pak package
1600V 3 Phase Bridge in a INT-A-Pak package
|
International Rectifier, Corp.
IRF[International Rectifier]
|
| 70MT100KB 70MT80KB 60MT100KB 60MT120KB 60MT140KB 6 |
ER 3C 3#12 PIN PLUG CRIMP
CONNECTOR ACCESSORY
THREE PHASE BRIDGE
800V 3 Phase Bridge in a INT-A-Pak package
1400V 3 Phase Bridge in a INT-A-Pak package
1600V 3 Phase Bridge in a INT-A-Pak package
|
IRF[International Rectifier]
|
| M74HC4094 M74HC4094B1R M74HC4094C1R M74HC4094M1R M |
From old datasheet system
8 BIT SIPO SHIFT LATCH REGISTER (3-STATE)
8 BIT SIPO SHIFT LATCH REGISTER 3-STATE
12-Bit DAC Parallel Voltage Out Pgrmable Int Ref Settling Time, Pwr Consumption, 8-bit uC Comp Int 20-SOIC 0 to 70
12-Bit DAC Parallel Voltage Out Pgrmable Int Ref Settling Time, Pwr Consumption, 8-bit uC Comp Int 20-TSSOP 0 to 70
|
SGS Thomson Microelectronics
STMICROELECTRONICS[STMicroelectronics]
意法半导
ST Microelectronics
http://
|
| GA200HS60S |
600V DC-1 kHz (Standard) Half-Bridge IGBT in a INT-A-Pak package 600V的直千赫的廉政（标准）半桥IGBT à - Pak封装
HALF-BRIDGE IGBT INT-A-PAK
|
Ecliptek, Corp.
IRF[International Rectifier]
|
| 112MT120KB 112MT120KBS90 112MT100KB 112MT140KB 112 |
THREE PHASE CONTROLLED BRIDGE
THREE PHASE CONTROLLED BRIDGE 三相控桥
CONN RING UNINSUL 12-10 AWG #10
HEADER, STRAIGHT, L/LATCH, 50WAY; Connector type:Wire-to-Board; Gender:Pin; Ways, No. of:50; Pitch, lead:2.54mm; Termination method:Solder; Material, contact:Phosphor Bronze (C510); Plating, contact:0.76u Gold over 2.54u Nickel; RoHS Compliant: Yes
CONN L/FORK UNINSUL 12-10 AWG #1
Ejector Latch; For Use With:3M Shrouded Latch / Ejector PCB Headers With Strain Relief RoHS Compliant: Yes
Ejector Latch; For Use With:3M Shrouded Latch / Ejector PCB Headers Without Strain Relief RoHS Compliant: Yes
800V 3 Phase Bridge in a INT-A-Pak package
1200V 3 Phase Bridge in a INT-A-Pak package
1600V 3 Phase Bridge in a INT-A-Pak package
1000V 3 Phase Bridge in a INT-A-Pak package
1400V 3 Phase Bridge in a INT-A-Pak package
|
International Rectifier, Corp.
IRF[International Rectifier]
|
| GLP532-10-3 |
The GLP532 is a green laser pointer of the newest design
|
Roithner LaserTechnik G...
|
| RLP-650-10 |
The RLP-650 is a red laser pointer of the newest design
|
Roithner LaserTechnik G...
|
| S3P7434 S3P7424 S3P7414 S3C7414 S3C7424 S3C7434 |
The S3C7414/C7424/C7434 single-chip CMOS microcontroller has been designed for very high performance using Samsungs newest 4-bit CPU core, SAM47
INDUCTOR HI FREQ 10NH 5% 0201
The S3C7414/C7424/C7434 single-chip CMOS microcontroller has been designed for very high performance using Samsungs newest 4-bit CPU core, SAM47
The S3C7414/C7424/C7434 single-chip CMOS microcontroller has been designed for very high performance using Samsungs newest 4-bit CPU core/ SAM47
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| GA400TD25S |
250V DC-1 kHz (Standard) Half-Bridge IGBT in a Dual INT-A-Pak package
HALF-BRIDGE IGBT DUAL INT-A-PAK
|
International Rectifier
|
| 795762012 795762100 795762101 795762102 795762103 |
IPASS (MINI-SAS) INTERNAL CABLE 36 CKT 4X W/ SIDEBANDS
36CKT IPASS W/SLEEVE WO/SB 0.6M INTERCONNECTION DEVICE
CABLE MINISAS INT M-M 36POS 1M INTERCONNECTION DEVICE
IPASS 36CKT INT CBL W/SLEEVE WO/SB 1M INTERCONNECTION DEVICE
|
Molex Electronics Ltd.
Molex, Inc.
|
| S3C7032 S3C7031 |
The S3C7031/7032 single-chip CMOS microcontroller has been designed for high performance using Samsungs newest 4-bit CPU core.
|
SAMSUNG[Samsung semiconductor]
|
| S3P72G9 S3C72G9 |
SAM47 INSTRUCTION SET
The S3C72G9 single-chip CMOS microcontroller has been designed for high performance using Samsungs newest 4-bit CPU core, SAM47 (Samsung Arrangeable M
The S3C72G9 single-chip CMOS microcontroller has been designed for high performance using Samsungs newest 4-bit CPU core/ SAM47 (Samsung Arrangeable M
|
http://
SAMSUNG SEMICONDUCTOR CO. LTD.
|
